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NEXTIN, Inc.

At a Glance

Business Type

Semiconductor Wafer Inspection System

Date of Foundation

1st, July 2010

Number of Employees

68

Annual Sales(USD)

2019

2020

8M US$

41M US$

Capital(USD)

2019

2020

1.3M US$

38M US$

Certifications

Designated as Innovative Tech company by Samsung. Received Jang Young Sil Tech Awards. Selected as Top 100 Small Giant in Materials, Components & Equipment Sector. Selected as Excellent R&D and Global Small Giant 200. CE & SEMI Certificate. ISO9001

Major Customers (%)

Korea ( %)

1

2

North America ( %)

1

2

COMPANY OVERVIEW

NEXTIN, a technology leading company in patterned defect inspection field of semiconductor industry, provides AEGIS wafer inspection systems for traditional wafer fabrication process and IRIS wafer inspection systems for 3-dimensional wafer fabrication process such as High-Aspect-Ratio process of 3D flash memory. Our innovative technology is qualified by leading-edge memory and logic device manufacturers. We keep providing the best solutions of defect inspection to device manufacturers.

MAIN PRODUCT

The AEGIS system with NEXTIN’s innovative two-dimensional imaging technology is a cost effective, high-performance defect inspection equipment. The high-resolution CMOS sensor, which allows high-speed and high-precision inspection, provides high throughput, lowers noise, and results in better signal-to-noise ratio (SNR) by applying two-dimensional imaging technology. Directional illumination filters out pattern signal and detects only interested pattern defects with high signal on the filtered images. Bright field and dark field inspection capability in one equipment can detect not only defects that are well detected by dark field inspection but also defects that are well detected by bright field. With this combo feature, AEGIS Wafer Inspection System can be used for all patterning (photo & etch) processes and film-related processes like CVD and CMP processes in FEOL (Front-End Of Line) and BEOL (Back-End Of Line).

The IRIS system with NEXTIN’s innovative three-dimensional imaging technology is the sole solution for 3-dimensional wafer fabrication process such as high aspect ratio process of 3D flash memory or TSV process of high bandwidth memory (HBM).

TECHONOLOGY DIFFERENTIATION

The AEGIS system with NEXTIN’s innovative two-dimensional imaging technology is a cost effective, high-performance defect inspection equipment. The IRIS system with NEXTIN’s innovative three-dimensional imaging technology is the sole solution for 3-dimensional wafer fabrication process such as high aspect ratio process of 3D flash memory or TSV process of high bandwidth memory (HBM).

China ( %)

1

2

Others ( %)

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